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Inquiry

YIHUA 993D/993D+ Series Programmable/Non-programmable BGA Rework Station

• Using the touch-screen design, easy to use and quick fashion.
• Non-programming style:
  1) Has ten working channel CH0 ~ CH9 can store various parameters, quickly select parameters according
  to IC type.
  2) Each channel has time to work, air flow, temperature three parameters, set the parameters according
  to IC type, time is set to 0 can not afford to start the machine.
• Programmable:
  1) Has ten programmable CH0 ~ CH9 working channels, each set up six working section.
  2) Can be viewed, set the time for each work period, the amount of wind, temperature, desoldering process
  temperature and time meet the performance requirements of the wafer.
• Table settings menu with password protection function.
• YIHUA993D is non-programmable; YIHUA993D+ is programmable; YIHUA993D+ upgrade version is non-programmable type and programmable type work together;

Our Engineering combined with Foxconn factory usage has calculated perfect program control scheme which can cover market 90% IC Disassembly.
Each SEG disassembled IC show standard desoldering temperature curve: SEG1 220℃ SEG2 260℃ SEG3 295℃ SEG4 320℃
Now write into machine factory setting

Steady work channel settings: Usage Scope and desoldering time
CH0 configuration 13*13 Nozzle Removable within 13 * 13MM IC program runtime 140S
CH1 configuration 19*19 Nozzle Removable within 19 * 19MM IC program runtime 165S
CH2 configuration 30*30 Nozzle Removable within 30 * 30MM IC program runtime 195S
CH3 configuration 35*35 Nozzle Removable within 35 * 35MM IC program runtime 210S
CH4 configuration 40*40 Nozzle Removable within 40 * 40MM IC program runtime 220S

CH5 configuration 13*13 Nozzle Removable within 13 * 13MM IC program runtime 60S
CH6 configuration 19*19 Nozzle Removable within 19 * 19MM IC program runtime 85S
CH7 configuration 30*30 Nozzle Removable within 30 * 30MM IC program runtime 95S
CH8 configuration 35*35 Nozzle Removable within 35 * 35MM IC program runtime 100S
CH9 configuration 40*40 Nozzle Removable within 40 * 40MM IC program runtime 110S