The WEP-899D-II hot air rework station comes with a hot air gun and soldering iron, suitable for soldering and de-soldering components of SOIC (small outline integrated circuit), CHIP card, QFP (quad flat package), PLCC (plastic leaded chip carrier), BGA (Ball Grid Array), and SMD (surface mounted device). This hot air rework station has the special advantages of de-soldering mobile phone flex cables and flex cable boards.
|Rated Voltage||AC 110V ±10% 60Hz/AC 220V~240V 50Hz|
|Hot air gun|
|Airflow Type||Brushless fan|
|Output Voltage||24V AC|
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